Where we can have impact
Through the heterogenous integration of compound semiconductors within silicon CMOS, we are bringing together the best characteristics of III-V materials and silicon on one monolithic integrated circuit (IC). Such chips will open up opportunities to impact design and development within vital areas of future technology.
Learn moreOur chips underpin:
Augmented Reality (AR)
The next-gen of AR products and glasses.
Virtual Reality (VR)
Breakthrough innovations in VR-related devices.
Smart Lighting
Smart lighting in architectural design and displays.
Wearables
Future products within wearable technologies.
Mobility
Key illumination components in tomorrow's vehicles.
Communications
Effective connectivity in 5G networks and beyond.